IC Semiconductor:

IC Assembly:

Mitsui High-tec is a leader in the contract IC Assembly business, in part due to its long role as a leader in providing precision lead frames to the semiconductor assembly industry.

Mitsui IC assembly facilities are located in Kumamoto, Japan (on Kyushu Island).

Mitsui has a broad package portfolio, including leaded packages like QFP, SOIC and TSOP, and no-lead packages QFN and SON, and custom BGA packages. Package thicknesses ranges from 2.1mm to 0.9mm. Mitsui provides Pb free and environmentally friendly green packages.

Link to IC Assembly package portfolio: www.mitsui-high-tec.com/en/prd/ic/ic_search.html

IC Assembly: Parts & Equipment

At Mitsui High-tec, we have developed a complete line of precision parts and equipment for advanced integrated circuit assembly. We used our in-house research capabilities and the most advanced manufacturing equipment available to develop IC leadframes, precision stamping tools, high-quality gold and silver spot-plating equipment, mold tooling, and trim and form tooling.

We entered the IC assembly market in 1984 with a determination to develop parts and equipment of worldwide utility.

Manufacturers around the world rely on Mitsui High-tecs for complete assembly service, from precision stamping and quality plating to final assembly, because its integrated mass-production system guarantees higher quality than in-house procurement programs.

Moreover, Mitsui High-tec closely monitors the production process to ensure that parts are delivered to customers in precise quantities, on time, and at the lowest possible price.

IC Leadframes: Precision Stamping

Integrated circuit (IC) manufacturers around the world rely on Mitsui's high precision tooling technology. In fact, our products were cited as the best in the industry by the U.S. magazine Electronic Business. We offer standard frames with anywhere from 8 to 240 pins and stamped from either ferro-nickel alloy 42 or the increasingly popular copper alloys. We also will work with a client to develop a custom design incorporating the ideal pin layout for special needs.

In either case, customers enjoy low prices and fast delivery. We cut about 90 percent off the cost of leadframe manufacturing when we began mass-producing frames with our own ultra-precise carbide dies back in 1970. Today, we are holding down prices and contributing to IC miniaturization with a revolutionary technique for stamping with a die face 10 to 30 percent thinner than the thickness of the material. And customers get their leadframes quickly since we fill orders at the plant in our global manufacturing network nearest to them.

We also offer leadframes for transistors and other semiconductors besides ICs, and all our leadframes are available in strips, reels, or magazines, as specified by the customer.

Contact Mitsui High-tec USA Sales for more information or visit www.mitsui-high-tec.com