IC Semiconductor:

IC Leadframes: Precision Stamping

Integrated circuit (IC) manufacturers around the world rely on Mitsui's high precision tooling technology. In fact, our products were cited as the best in the industry by the U.S. magazine Electronic Business. We offer standard frames with anywhere from 8 to 240 pins and stamped from either ferro-nickel alloy 42 or the increasingly popular copper alloys. We also will work with a client to develop a custom design incorporating the ideal pin layout for special needs.

In either case, customers enjoy low prices and fast delivery. We cut about 90 percent off the cost of leadframe manufacturing when we began mass-producing frames with our own ultra-precise carbide dies back in 1970. Today, we are holding down prices and contributing to IC miniaturization with a revolutionary technique for stamping with a die face 10 to 30 percent thinner than the thickness of the material. And customers get their leadframes quickly since we fill orders at the plant in our global manufacturing network nearest to them.

We also offer leadframes for transistors and other semiconductors besides ICs, and all our leadframes are available in strips, reels, or magazines, as specified by the customer.

Link to open lead frame list: www.mitsui-high-tec.com/en/prd/lf/lf_search.html

IC Leadframes: Quality Plating

High-quality gold plating or silver plating is the essence of our leadframe performance. Mitsui High-tec began spot-plating in 1977 to reduce per frame use of expensive gold material. The current trend toward copper leadframes is encouraging a shift from gold plating to silver plating. We spot-plate leadframes with silver or gold (bright or dull) and do full plating in silver.

NiPdAu (Nickel Palladium Gold) flood plating is another popular plating option, which helps customers world wide achieve Pb-free (lead free) IC packaging.

Today's IC industry presents an incredibly diverse range of demand for leadframes, often in small quantities. This is why flexible-system production is used at Mitsui High-tec. Our highspeed, reel-to-reel plating lines combine the responsive adaptability of small-lot manufacturing with the fast, economical efficiency of mass production. Moreover, our careful monitoring of production processes and our integrated capabilities for plating, downsetting, and taping assure customers of uniform plating.

IC Leadframes: Photo Etching

Mitsui High-tec has advanced the state of the art in stamped IC leadframes with an original manufacturing process that improves quality consistency and reduces costs.

Advances in microelectronics have led to increased demand for electronic devices with greater integration, higher pin counts, and shorter delivery times. Our new photo-etching process for manufacturing leadframes helps device manufacturers meet these demands by reducing costs, increasing design flexibility, and improving manufacturability.

The process makes it possible for us to participate in product development from the earliest stages and offer solutions to design problems before converting to stamping tools. Cost-efficiency is greatly improved as a result.

Mitsui High-tec is a pioneer in die manufacturing and the world's foremost supplier of leadframes. We continue to help our electronics manufacturing customers improve their products with our integrated approach to technological advancement, incorporating basic research, prototype development, and mass production.

Contact Mitsui High-tec USA Sales for more information or visit www.mitsui-high-tec.com -