A series of technological innovations have made Mitsui High-tec a leader in the die industry. Manufacturers worldwide use our dies to stamp items: rotors and stators for electric motors; components for automobiles, appliances, and communications gear; leadframes for ICs; and transfer molds. Mitsui High-tec engineers got the Company off to a solid start in 1949 by perfecting a new technique for grinding dies after heat treatment. This advanced die precision to within microns and established Mitsui High-tec's reputation for technological excellence.

In the late 1950s, we were internationally recognized for our improvement of U.S. technology for producing tungsten carbide dies. These were harder than conventional steel dies, less affected by heat, and durable enough to do an unprecedented one million continuous stampings for each of up to 100 sharpenings.

We greatly enhanced our ability to serve customers in 1982 when we upgraded the software in our computer-aided design (CAD) system for precision dies. Tied into an automated production system, this improvement helps us get needed dies quickly to customers.

Mitsui's world-class facilities insure not only better quality through environmental control; Mitsui's plant is efficient and organized to gain all benefits from economy of scale, just-in-time logistics, and ownership-based control methodologies to insure each job is done right the first time.

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From the designing and manufacturing of dies to the stamping of cores, Mitsui's integrated global production system guarantees "top quality" and "low cost".

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Leadframes have complicated shapes and, for punching such complicated shapes, some punches are thinner than a human hair and require the keenest care in machining and assembling. It is only our long-accumulated technology that enables such difficult work.

* IC leadframe toolings are used for in-house stamping and are not sold as separate entities.

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Mitsui internally produces stamping tools for high-volume production of IC leadframes and the injection mold tooling used in the assembly of semiconductors.

In assembling an IC leadframe, a mold die is necessary for encapsulating the semiconductor chips. The extension of our motor core and leadframe tooling capabilities allows us to respond to customers' requirements in a swift and sophisticated manner by internal production of the mold dies.

We are also engaged in the production of "trim and form" dies that form the outer leads of an IC package to enable final mounting on the circuit board. By the combination of punching, sector-bending, cam-bending and other techniques, we can accommodate almost any shape. In addition, we also market simplified presses for the low-volume stamping. Please consult with us when you consider the introduction of said press.

Our stamping technology includes applications for hard materials as well. We are confident that our sub-micron order precision tooling will meet your needs with excellent performance, trouble-free operation, and easier maintenance.

Typical applications

Ceramic punching dies: For manufacturing various electronic parts

Food package punching dies: For manufacturing pouched packages
(for refreshing drinks, dairy drinks, etc.)

Thin stainless steel sheet punching dies: For HDD pickup, etc.